Hybrid Microcircuit
Design & Manufacturing Services
Hybrids Manufactured by Aerospace Semi
Hybrid Microcircuits consist of a mix of devices in a single package. It is a miniaturized electronic circuit constructed of individual devices, such as transistors, diodes or monolithic ICs, and passive components such as resistors, inductors, transformers, and capacitors, bonded to a substrate. These small custom packages result in higher performance modules than may be available through the application of typical commercially available components.
Multi Chip Module
This hybrid contains 8 Analog integrated circuits and 83 capacitors. The 1.2″ x 3.25″ substrate has 130 J leads attached.
Precision Analog Hybrid
This analog circuit contains 4 integrated circuits, 7 transistors, 4 capacitors, and precision thick film resistors with ratios of 0.1%. The substrate has 36 J leads attached and is protected by a ceramic cover (not shown).
Optical Isolators
This hybrid contains 10 optical isolators, 10 integrated circuits, thick film resistors, and ceramic capacitors. The substrate is housed in a 44 pin bathtub package.
Round Hybrid
This hybrid contains two integrated circuits, precision thin film resistors, thick film resistors, and capacitors. The substrate is soldered to pins in a 0.8″ bolt circle.
Hybrids sealed into hermetic packages
Need a rugged, hermetic package? We can package your complete circuit into a variety of TO style hermetically sealed packages. For example, this instrumentation amplifier is sealed into a TO-8 package, which fits nicely inside the circular stainless tube that houses a precision transducer module.
Hybrids
This hybrid mounts directly to a small piezo electric accelerometer to function as a charge amplifier and 4-20ma transducer for an accelerometer used in the construction industry. The hybrid is designed to measure accelerations in excess of 5000G repeatedly during pile driving and other construction and mining operations.
Coil Timing Controller
These hybrids are designed to minimize power consumption of coil switching in airplane solenoids, relays and other electro-mechanical actuators. The hybrid increases coil current during switching phase, and decreases current during the holding phase, so as to limit excess power consumption. They may be embedded inside a potting compound as part of the overall relay or electro-mechanical housing.
Remote Relay Controller
This hybrid is embedded inside a potted power relay in aircraft applications. The analog portion integrates relay current flow over time and if a threshold is exceeded triggers digital logic to open the relay and allow reset from a remote location. This reduces heavy wiring in aircraft applications and allows for selectable over-current conditions.
Brake Temperature Measurement
These hybrids provide a redundant, highly reliable measurement of brake pad temperature for commercial and business jets applications reducing the risk of brake fires during aircraft ground operations.
Pedal Transducer
These hybrids include a complex analog circuitry which is used to accurately, reliably and redundantly measure pedal position in modern fly-by-wire aircraft.
Pin Driver Hybrid
This circuit contains transistors, diodes, thick film resistors, and bypass capacitors. The substrate is housed in a 24 pin ceramic package. This hybrid has twice the slew rate of the same circuit on a printed circuit board. This is due to the lower parasitic capacitance of chip & wire construction.
Servo Loop Hybrid
This hybrid circuit contains 8 integrated circuits, 2 output MOSFETS, thick and thin film resistors, and 8 capacitors. The substrate is housed in a 32 pin ceramic package.
Power Supply Hybrid
This circuit contains a surface mount microprocessor, a crystal oscillator, capacitors and resistors, 2 chip and wire integrated circuits, diodes, and two power MOSFETS. The 1.15″ x 0.8″ substrate has 30 J leads attached.
Surface Mount Flat Pack Hybrid
This hybrid contains the following surface mount components: 5 integrated circuits, 16 capacitors, and 21 resistors. For high reliability, the substrate is housed in a hermetic flat pack.
Power Module Hybrid
This hybrid contains 4 size 6 power FETS, 2 transformers, an inductor, an optocoupler, 4 integrated circuits, 12 capacitors, 15 resistors, 9 transistors, and 8 diodes. For low resistance, the power FETS are bonded with 20 mil wire. The 1.53″ x 1.65″ ceramic substrate has a seal ring and power and signal leads.
Hybrid Accelerometer for Missiles
These hybrids provide instrumentation electronics for an accelerometer in a missile application. They are designed to be small, lightweight, and handle the extreme accelerations experienced during missile launch.
Aerospace Semiconductor combines a proven process with a drive to design hybrid circuits that meet or exceed your needs.
Complete our online form or call us today at 978-688-1299 to explore the ways that we can solve your hybrid microcircuit problems.
Advantages of a Hybrid
Long Term Reliability: Most commercially packaged semiconductors will have a life span measured in years, while hybrids have a life span measured in decades. This long lifespan is critically important for applications with a long service life, or limited service access, such as space applications, deep ocean wells or other remote applications.
Low Failure Rate: Aside from long term reliability, hybrids also exhibit a lower Mean Time Between Failure (MTBF) rate when exposed to environmental stresses such as high temperature, temperature cycling, mechanical vibration or other harsh conditions.
High Temperature Applications: When electronics operate at elevated temperatures the materials used can have a substantial impact on performance and life. When operating above 125C these issues become particularly critical, mandating a full review from the ground up, of all materials and manufacturing methods used in the microelectronic assembly process.
Small Size and Weight: In applications where a high premium is placed on small size and weight, such as aircraft, missiles and spacecraft, hybrids can offer an extremely compact, high performance solution.
Custom Packaging: Hybrids, or custom monolithic IC packages, provide flexibility for shape and package style, as well as the option for improved performance such as improved thermal conduction, lower inductance power paths, shielding of critical instrumentation circuitry, and unmatched RF performance capabilities.
Aerospace Semiconductor combines a proven process with a drive to design hybrid circuits that meet or exceed your needs.
Complete our online form or call us today at 978-688-1299 to explore the ways that we can solve your hybrid microcircuit problems.
Components of a Hybrid Microcircuit
Power Devices: In hybrids, high power devices can be strategically placed to minimize wirebond lengths and power or signal loss caused by wire inductance or resistance. Related devices can be placed nearby, and all can be thermally attached to a heat sink, or heat conduction path out of the device.
Thermal Management: Hybrids can be constructed of high performance thermal materials if needed to maximize heat conduction away from the IC, reducing IC junction temperature and allowing the IC to function at a higher level, with a longer life, than otherwise would be possible.
Proprietary Circuits: Hybrids circuits allow equipment manufacturers to hide proprietary circuit details inside the sealed hybrid module, thereby making it more difficult for competitors to reverse engineer critical circuit elements.
Capacitors: Capacitors mounted internal to the hybrid allow for very close decoupling of power supply rails, or carefully controlled connection to critical signals.
Printed Resistors: Printed resistors offer a more reliable alternative to small passives attached to the substrate. They are far less susceptible to cracking of the attachment joint, and have a smaller mass making them less susceptible to damage during impacts.
Wirebonded ICs: ICs are wirebonded directly to the substrate in hybrids, eliminating the traditional package around an IC. Wire bond material, diameter, bond type, and wire bond length and shape can also be tailored to best suit the application and material characteristics of the bond pad plating on the die. This produces a more reliable connection than commercially packaged circuits.
Aerospace Semiconductor combines a proven process with a drive to design hybrid circuits that meet or exceed your needs.
Complete our online form or call us today at 978-688-1299 to explore the ways that we can solve your hybrid microcircuit problems.
The Development Process
Some customers bring Aerospace Semiconductor, Inc. a concept and ask us to provide complete design and manufacturing services. Others have a schematic for a design for us to complete, or perhaps an existing product they need to have miniaturized. Or, they already have a complete, detailed design and wish to employ us for its manufacture.
Regardless of the starting point, Aerospace Semiconductor utilizes the same, proven development process to produce high quality components, in a reliable manner, to meet our customers’ needs.
Aerospace Semiconductor’s development process leads us and you along a clear and concise path towards satisfying your hybrid microcircuit needs.
- First, our development process starts with an intensive confirmation of your requirements and a preliminary prototype design during which we solicit your input. Our goal is to work with you closely to minimize negative surprises and costly rework. The deliverable for these first three steps is a functioning design that meets your requirements.
- Next, Aerospace Semiconductor designs the production substrate as well as the production process and builds the first set of components. At this point we obtain your approval of the design.
- With your approval we produce the first production lot, test it, and modify the design as required.
- After a successful first production lot, along with any modifications, we release the part for full production.
From Concept through Production Aerospace Semiconductor Delivers Industry Leading Microcircuits